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The OK-SP460-I combines high-precision solder paste printing with integrated 2D solder paste inspection in a single machine footprint. By verifying print quality immediately after each cycle, it provides closed-loop feedback for real-time process control, catching defects before they reach reflow — critical for zero-defect SMT manufacturing.
| Parameter | Value |
|---|---|
| SPI System | Built-in 2D Solder Paste Inspection |
| Camera Resolution | 5MP Industrial CMOS |
| Inspection Coverage | 100 percent post-print area |
| Inspection Speed | under 3s per board |
| Detectable Defects | Bridging, insufficient paste, offset, smear |
| Max PCB Size | 510*460mm |
Essential for automotive electronics (ISO 26262), medical device PCBs (ISO 13485), aerospace modules, and any application where post-reflow rework is impossible or cost-prohibitive. Recommended for lines targeting under 50 dppm defect rates.
Precision instrument-grade packaging with vibration-isolated mount in export wooden crate. Pre-shipment calibration report included. Shipping within 7-15 working days.